Technology / Solutions – WiConnetGlobal

Technology & Solutions

WiConnect Global develops advanced optical interconnect technologies based on silicon photonics and integrated laser comb architectures, enabling scalable, energy-efficient data transfer for next-generation data center and AI infrastructure

Optical Interconnect Technology

Our architecture integrates an on-chip laser comb source with microring-resonator–based modulation and wavelength multiplexing, enabling dense DWDM operation across multiple optical bands (O, E, S, C, L, and U). Adjustable channel spacing allows flexible wavelength allocation for different system requirements, while a single-fiber transmit and single-fiber receive interface simplifies optical connectivity and fiber management.

Core Solutions

Integrated Laser Comb Source

On-chip multi-wavelength light generation enabling high-density DWDM across multiple optical bands with tunable channel spacing.

50+ Channels per Optical Band

Multi-Band Coverage (O to U Bands)

Tunable Channel Spacing (50 to 400 GHz)

Silicon Photonics Integration

Advanced silicon-photonics platforms enabling scalable and manufacturable optical connectivity.

Designed for volume manufacturing

CMOS-compatible processes

Device-level and system-level optimization

Co-Packaged Optical Solutions

High-bandwidth optical interconnect architectures designed for chip-to-chip and system-level communication..

Ultra-high bandwidth density

Low-loss optical signaling

Semiconductor-grade integration

Photonic Chiplets

High-performance photonic transceivers engineered for demanding AI, HPC, and data center workloads.

High data rates

Lowest latency interconnections

Energy-efficient design

Core Solutions

Optical Interconnect Architecture

High-bandwidth optical interconnect architectures designed for chip-to-chip and system-level communication..

Ultra-high bandwidth density

Low-loss optical signaling

Semiconductor-grade integration

Silicon Photonics Integration

Advanced silicon-photonics platforms enabling scalable and manufacturable optical connectivity.

Designed for volume manufacturing

CMOS-compatible processes

Device-level and system-level optimization

Co-Packaged Optical Solutions

Co-packaged optics that tightly integrate photonics, electronics, and packaging to reduce power and latency.

Reduced electrical I/O bottlenecks

Improved power efficiency

Optimized for next-gen computing platforms

Photonic Transceivers

High-performance photonic transceivers engineered for demanding AI, HPC, and data center workloads.

High data rates

Lowest latency interconnections

Energy-efficient design

Technology Advantages

Stats / Points:

45x higher bandwidth
Simplified Optical I/O Architecture
50% more energy efficient
Lowest latency interconnections
US patent issued

Applications

Artificial Intelligence & Machine Learning
High-Performance Computing (HPC)
Telecommunications Networks(HPC)
Chip-to-Chip Optical Interconnects(HPC)
Data Centers & Cloud Infrastructure
Advanced Semiconductor Platforms

Technical Specifications

Wavelength Channels: 50+ per band
Aggregate Bandwidth: Multi-terabit-class architecture
Optical Bands: O, E, S, C, L, U
Modulation: Resonator-based wavelength multiplexing
Laser Source: Integrated on-chip comb
Channel Spacing: Programmable
Interface: Single-fiber TX / single-fiber RX
Manufacturing: CMOS-compatible silicon photonics

C-Band High-Density Laser Comb - 100 GHz Channel Spacing

O-Band High-Density Laser Comb - 100 GHz Channel Spacing

C-Band High-Density Laser Comb - 400 GHz Channel Spacing

O-Band High-Density Laser Comb - 400 GHz Channel Spacing

partners

Our technology is developed with a strong understanding of both device-level photonics and system-level architecture, enabling close collaboration with ecosystem partners and platform developers