WiConnectGlobal Corp., a member of NVIDIA Inception Program and Silicon Catalyst Accelerator




Photonic Chiplets
WiConnectGlobal is a driver behind NexGen’s Data centers highspeed photonic interconnects. We develop fast optical devices, with high reliability, low power consumption, and high degree of scalable economics that addresses $/Gbps, pJ/bit energy metrics, and bits/s/Hz Bandwidth expansion. Our Co-packaged solutions with hybrid integration between different technologies are essential for processing AI/ML Data traffic. The integration of electronics, photonics and packaging will deliver a state of the art solution to the industry for addressing current technical challenges. Our solution allows connections in a massive configuration for AI tailored datacenters while providing Reduced Latency, Enhanced Bandwidth, Lower Power Consumption, and Increased Scalability.

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The Photonic Chiplet is a cutting-edge silicon photonies-based optical interconnect solution designed
to enhance high-bandwidth, low-power communication in data centers and high-performance computing
environments. Our solution supports 50 Dense Wavelength Division Multiplexing (DWDM) channels
per band, each operating at 50Gb/s, providing an aggregate bandwidth of 2.5Tb/s. The solution covers
any of the O, E, S, C, L, and U optical bands, ensuring broad spectral coverage and compatibility with a
wide range of optical network architectures. Additionally, it features an integrated laser comb source
with adjustable channel spacing (tunable from 25GHz and up to 1000GHz), allowing flexible
wavelength allocation and enhanced spectral efficiency. The optical interface is based on a single fiber
for transmit and a single fiber for receive, simplifying fiber management and reducing system
complexity.
Enables compact, high-performance optical communication with
superior scalability.
Lower Latency Interconnections
A hi-tech Startup in Maryland. The Company uses Fabless model for developing photonic integrated circuits using Silicon Photonics platform (CMOS process compatible). We design and produce photonic components and subsystems for fiber optic communications for short and ultra-short reach interfaces for chip-to-chip and board-to-board connections in Datacenter with AI/ML applications.
6751 Columbia Gateway Dr.Columbia, MD 21046